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LATEST NEWS
Sunpower Award
Another Service Achievement for Cirtek
Outstanding Supplier Award
Delivery Excellence Award
Cirtek's building 2 is on its final stages . . . . . .
The evolution of Cirtek's DFN/QFN packaging . . . .
Cirtek is going full blast on lead free implementation
CIRTEK PRODUCTS
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Our Customer is our Business Partner
Services Offered and Capability
WAFER BACKGRINDING
(8” MAX DIAMETER)
WAFER MAPPING
(8” MAX DIAMETER / ASCII FORMAT)
WAFER PROBING
(6” MAX DIAMETER)
DIE INSPECTION
(COMM / MILITARY LEVEL OF INSP.)
ASSEMBLY
(REFER TO PKGE PORTFOLIO)
MARKING
(INK / LASER)
FINAL TEST
(REFER TO TEST CAPABILITIES)
TAPE AND REEL
(SOT, 150 AND 300 MIL SOIC)
TAPE AND AMMO
(TO - 92)
DROP SHIPMENT
(TO ANY POINT AS REQUIRED)
WAREHOUSING
PACKAGE / LEADFRAME DESIGN AND DEV’T
RAW MATERIAL SOURCING
RELIABILITY AND FAILURE ANALYSIS
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