Services Offered & Capability
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| WAFER BACKGRINDING | (8” MAX DIAMETER) |
| WAFER MAPPING | (8” MAX DIAMETER / ASCII FORMAT) |
| WAFER PROBING | (6” MAX DIAMETER) |
| DIE INSPECTION | (COMM / MILITARY LEVEL OF INSP.) |
| ASSEMBLY | (REFER TO PKGE PORTFOLIO) |
| MARKING | (INK / LASER) |
| FINAL TEST | (REFER TO TEST CAPABILITIES) |
| TAPE AND REEL | (SOT, 150 AND 300 MIL SOIC) |
| TAPE AND AMMO | (TO - 92) |
| DROP SHIPMENT | (TO ANY POINT AS REQUIRED) |
| WAREHOUSING | |
| PACKAGE / LEADFRAME DESIGN AND DEV’T | |
| RAW MATERIAL SOURCING | |
| RELIABILITY AND FAILURE ANALYSIS | |