left
 
   COMPANY PROFILE
Home Contact Us
About Us
Quality
    PRODUCTS AND SERVICES
Products and Services Package Drawing
Services Offered
Test System Platform
Package Porfolio
Special Product Capabilities
    LATEST NEWS
Sunpower Award
Another Service Achievement for Cirtek
Outstanding Supplier Award
Delivery Excellence Award
Cirtek's building 2 is on its final stages . . . . . .
The evolution of Cirtek's DFN/QFN packaging . . . .
Cirtek is going full blast on lead free implementation
 
 
    CIRTEK PRODUCTS
   
   
  right
Buttons
   HOME   ABOUT US   QUALITY   SERVICES   CONTACT US
 
Our Customer is our Business Partner
 
 

Our Services

CIRTEK has been known as one of the most focused independent electronic manufacturing assembly facility in Southeast Asia. We have maintained the same intensity of dedication and commitment in providing a full range of world class services to our customers.

Packaging Services range from Quad/Dual Flat No lead package, PDIP, SOIC, SOIC with embedded Crystals , MSOP, PSOP, Discrete, standard transistor outline, small outline transistors, RF oscillator assembly and surface mount assembly as well as the custom made packages.

Package outlines are either customized or the JEDEC standard. Processes are capable of meeting MIL STD 883 requirements for monolithic, microelectronic circuits and MIL STD 750 requirements for discrete device packaging.    
Cirtek still maintains its hermetic assembly to cater for those customers that have specific packaging requirements for Saw Filter ceramic, RF modules ceramic, LCC, Crystal Oscillators, Multi Chip Modules and metal can assemblies.

Cirtek house an SMT ( Surface Mount Technology) production line equipped with top of the line precision machines and tools to produce quality modules. The facility includes top of the line screen printers, reflow furnaces and frequency analyzers.
 
 
CIRTEK SERVICE OFFERING
 

Assembly - Cirtek's Front Line Assembly is maintained in a clean room environment that is compliant to industry standard. It is equipped with back lapping capability on 8 inches wafer diameter and can backlapped up to eight (8) mils wafer thickness.

We employ only advance die attach machines equipped with wafer map capability, and wire bonding that is capable for 45 microns bond pad opening.  
 
  Final Testing - Cirtek's testing capability started from a simple open/short test in the early 90's to DC functional testing and now with capability to provide simple test program development and conversions. Customer's need for global competitiveness enabled us to expand our test capabilities from DC functional testing to Mixed Signal testing, Digital testing and wafer probing, including the latest acquisition of our full RF testing.

 

Buttons
Home About Us Quality Services Contact Us

Copyright (c) 2005 Cirtek Electronics Corporation. All Rights Reserved.
Web Design and Development by www.WebCoastDesign.com