Failure Analysis Capability

INTERNAL / EXTERNAL INSPECTION: (HIGH / LOW POWER MICROSCOPE)
X-RAY: (SOFTEX 100)
DECAPSULATION: (DECAP AS 2000)
AUTOCLAVE: (NAPCO 8110-TD TEST CHAMBER)
OPEN / SHORT TEST : (TEXTRONICS CURVE TRACER)
TEMPERATURE CYCLE: (ENVIRO SYSTEM CHAMBER)
SOLDERABILITY TEST: (STEAM AGER / SOLDER BATH)
85% / 85oC MOISTURE SOAK: (ENVIRO SYSTEM CHAMBER)
C-SAM : (SONIX 1000)