Plastic Molded Oscillator Modules
Components mounted into the circuit include an IC chip, capacitors and a crystal in sealed form. Unlike the cavity hybrid oscillator models, the packaging process is less complex. There are fewer components, and the crystal is supplied ready for mounting.
However, the chip capacitor attach process is a very critical and delicate step due to a susceptibility to epoxy bridging conditions. The technique involves a variety of machine and equipment combination such as automatic die bonding of the IC chip on an ASM die bonder, automatic pick and place for the capacitors and crystal on a KME chip mounter after an automatic epoxy dispense on a CAM/ALOT dispenser. The mounting sequence is defined such that very little or no disturbance at all is inflicted by an ongoing process to the other components which were previously mounted on the circuit.
Wire bonding is typically done on Kaijo automatic ball bonders with 1.3 mil gold wire. The final product is plastic transfer molded and formed for surface mount applications. Electrical continuity test is performed on all parts prior to shipment.