Microwave & RF Modules
These modules are assembled in multiple sets, each set could be similar with the other set. Typically a ceramic substrate is used but FR-4 fiberglass is an alternative material for some devices.
Diode chips are mounted on substrates with silver-filled epoxy and wired with 1.0 mil Au wire on a thermosonic gold ball bonder.
Lid capping of the cavity-type package uses premixed adhesive of resin and hardener applied along the peripherals of the package base. Capping alignment is critical. Extreme care is necessary to avoid risks of inducing damage to the circuit.
Parts are top branded and shipped on tape and reel.