Amplifier Circuits
This hybrid assembly is dependent largely on an active device emanating from a GaAs thin wafer technology. This chip combines with one or two chip capacitors in a Silicon MOS technology to complete a low-noise, high power amplifier circuit.
Owing to the very thin features of the die, assembly handling is treated with utmost care. Chip attach is done with Au-Sn eutectic preform on a Westbond work stage at temperature conditions of up to 300 degrees Centigrade. This process is done under a hot forming gas blanket.
The circuit is connected to the substrate by a combination of very long wires with double stitch bonds and very short wire spans. This is made possible on a Kaijo automatic thermosonic ball bonder.
The final product is a hermetically sealed package for surface mount applications. Parts undergo 100% DC parametric testing, and then shipped on tape and reel.